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We present only rough submicronic assembly, however solutions for subnanometric
assembly are well known ; in fact, actual technology produce imperfect
objects (scarcely better than 0.1 µm over 10 mm) and don't need very
high precision for object micropositioning. As for the the problem of the
egg and the chicken, one produce the other but what come in first ? In
this case, many solutions exist but the needs remain low because of the
prices and probably also because of the lack of informations.
Here, the submicronic precision of assembly is all obtained by controling
the mechanical positions under interferometric vision in white light.
The images we propose are related to the following paper :
"Interferometric Micropositioning in the Planar Chip Insertion Technique
for Multichip Modules (MCMs)",
Microelectronics International, Number 36, January 1995, pp.
A. Vareille, A. Schiltz,
Ballet, J.C. Haüuy and L. Thévenot.
The purpose of this work was to realise big circuits with many silicon
chips ; the way chosen was to cut holes in an interconnection networks
and then to insert the chips in the holes in order to use optical microlithography
for achieving interconnections between chips and the network or either
to use short planar wire bonding.
The Packaging with Dicing, Die Attach and Wire Bonding were performed
by Yves Gambérini.
Few functional hybrids were used for HDTV demonstrations at the Winter
Olympic Games 1992 in Albertville.
For the three major steps in assembly we obtained interesting images
Animated GIF of 263 kB :
Pieces preparation : the holes for the chips were obtained by laser cutting.
Animated GIFs of 192 and 161 kB :
Chip micropositioning : interferometric vision has been used for setting
and maintaining the pieces in right position.
Animated GIF of 594 kB :
Glue injection : picoliter capillarity under interferometric vision was
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